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Technical Program CommitteeTechnical Program Committee Members O.B. Akan, METU, Turkey C. Borcea, NJIT University, USA Ying Cai, Iowa State University, USA R.H. Campbell, UIUC, USA J. Cao, Polyt. Univ., Hong Kong Z. Chen, Florida Int. University, USA L. Cheng, Lehigh U. Bethlehem,USA Russel Clark, Georgia Tech, USA Laurens Cloete, CSIR, South Africa E. Ekici, Ohio State Univ., USA Anastasius Gavras, Eurescom, Germany M. Gerla, UCLA, USA G. Giambene, Univ. Siena, Italy Roch Glitho, Concordia Univ. Montreal, Canada Tao Gu, Inst. Infocomm R., Singapore X. Gu, TU Braunschweig, Germany Mesut Gunes, FU Berlin, Germany R. Hill, Indiana University, USA Stefan Holtel, Vodafone, Germany L. Iftode, Rutgers University, USA Ajit Jaokar, Futuretext, UK T.G. Kanter, Mid Sweden U., Sweden P.J. Keleher, Univ. Maryland, USA U.C. Kozat, DoCoMo Labs, USA P. Langendoerfer, IHP, Germany Xiaolin Li, Oklahoma State U., USA P. Lorenz, U. Haute Alsace, France Robert Minerva, Telecom Italia, Italy G. Morabito, Univ. of Catania, Italy Telma Mota, PT Inovacao, Portugal Tatsuro Murakami, NTT Labs, Japan P. Nixon, U. College Dublin, Ireland Gaston S. Ormazabal, Verizon Labs, USA S. Pandey, CISCO, USA G. Pau, Univ. California at Los Angeles, USA G.-C. Roman, WUSTL, USA Roland Schwaiger, Deutsche Telekom Lab, Germany J. Shen, Microsoft Research, China J. Taheri, Univ. of Sydney, Australia A. Tripathi, Univ. of Minnesota, USA Vijay Varma, Telcordia, USA Neco Ventura, Univ. Cape Town, South Africa M.A. Youssef, Univ. of Maryland, USA F. Zambonelli Univ. Modena, Italy L. Zhang, Indiana Univ. S. Bend, USA |